The production of GM55 material is used in mobile phone partitions, navigation, etc. The product has high strength, good toughness, and does not crack when bent.
In the accelerated upgrading of 3C products, GM-55 is widely used in the field of 3C products with its perfect heat dissipation function, low density, excellent compressive strength, no magnetism and excellent processing performance. The heat dissipation performance of GM55 is 7-9 times that of stainless steel. The density is one-third that of stainless steel, and the anode works particularly well. In the accelerated development of 3C products such as mobile phones/computers/TVs/navigation towards thin, light, multi-core, etc., it is recognized as the best raw material for mobile phone mid-board.
GM55 3C products aluminum coil strip stock Physical properties:
1. Electrical resistance 27.2 (%IACS)
2. Heat transfer 110 (W/mK,@25 dec.C)
3. Yield coefficient 70 (KN)
4. Melting point 575 (deg, C)
5. Density 2.64 (g/cm3
GM55 3C products aluminum coil strip stock characteristic:
1) 5000 series is the strongest
2) H38 can be used for light spinning;
3) Good acid resistance and corrosion resistance;
GM55 (Al-Mg series) mechanical parameters:
Hardness O H32 H34 H36 H38 H18
Ultimate tensile strength (N/mm2) 290 295 350 375 400 430
Yield strength (N/mm2) 130 160 250 295 310 370
Elongation (%) 33 28 15 13 12 8
The advantages of GM55 3C products aluminum coil strip stock are light weight, improved heat conduction (dissipation) effect, completely non-magnetic, does not affect GPS function and so on. Now GM55 has been widely used in the industry: TCL, OPPO, HTC, NOKIA (Nokia), Samsung and other mobile phones, the main accessories are mobile phone mid-board, and also widely used in ASUS and ACER computer accessories.